Technical Capabilities
Text Box: Basic Processing Chemistries RoHS processing (Sn96.5/Ag3.0/Cu0.5) Traditional processing (Sn63Pb37) Water soluble and No-Clean Placement Capabilities Smallest package size placed: 0201 Largest lead/ball count placed: 1,156 Largest package size: 50mm Finest lead/ball pitch: 0.4mm Feeder capacity of over 250 part numbers per line Placement rates of up to 29,000 cph per line Assembly Techniques and Capabilities Double Sided Reflow Pin-In-Paste processing Selective soldering Text Box: Test and Inspection Automated Optical Inspection X-Ray Inspection Functional testing Flying probe testing Conformal Coating Automated machine with 5-axis spray head Manual coating booth for small runs Acrylic, Urethane, Silicon conformal coatings Electro-Mechanical (Box Build) Assembly Complete chassis or Sub-assemblies Water-proof sealing and testing of units Potted Modules Epoxy, Urethane, Silicon potting compounds Shell and fixtured molding

Proven Performance in

Electronic Manufacturing

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